With the two new AIM IIIc sys­tems, the com­pany is bring­ing the lat­est gen­er­a­tion of the FUJI assem­bly sys­tem into pro­duc­tion. While the pre­vi­ously used AIM machine achieved a max­i­mum through­put of 30,000 com­po­nents per hour, pro­duc­tion vol­umes of up to 80,000 com­po­nents are now even pos­si­ble in 2-head mode. The pick-and-place machines have been spe­cially devel­oped for high-mix pro­duc­tion. They process both very small and very large parts and mount 2 PCBs simul­ta­ne­ously. With 260 feeder slots avail­able, all com­po­nents rel­e­vant to the pro­duc­tion process can be loaded, so changeover times are min­i­mal. “HESCH pro­duces over 300 dif­fer­ent cir­cuit boards, so it is an advan­tage if the changeover takes lit­tle time. Highly com­plex PCBs, which in the past required two assem­bly passes, are now assem­bled in one pass“, reports Alexan­der Wicht, the team leader of the flat mod­ule pro­duc­tion.

HESCH is also one of the first com­pa­nies in the indus­try to use Fuji’s new Glue Tool. This gives com­po­nents that are dif­fi­cult to process an addi­tional fix­a­tion, which ensures that the com­po­nent does not slip dur­ing the sol­der­ing process. The auto­matic machines can be loaded quickly and assem­ble PCBs up to a size of 508 x 400 mm with a place­ment accu­racy of ±0.025 mm. Exten­sive checks (LCR/coplanarity) pre­vent errors in the place­ment of com­po­nents on the PCB.

With the new place­ment machines, HESCH is cre­at­ing the pre­req­ui­sites for opti­mally meet­ing its cus­tomers’ require­ments in the future as well